[硬件]导热垫(Thermal Pad)和导热过孔(Via for thermal pad)

什么是导热垫，导热过孔？ PCB散热垫中的散热孔通常用于将热量从器件传导出去，并有效地将热量从PCB的顶部铜层传递到内部或底部铜层或外部环境。 Thermal vias in the PCB thermal pad are typically used to conduct the heat away from the device and to transfer effectively the

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